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代理产品

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代理产品

Products > SULLINS > Ruggedized Double Point & MBB Card Edge
Ruggedized Double Point & MBB Card Edge
Headers | Card Edge - 200/250°C | Card Edge - 125/150°C | High Density Card Edge - 125/150°C | Dual Edge- NEW PRODUCT OFFERING | Ruggedized Double Point & MBB Card Edge |

>> Mate before Break

GBC12DCSN-S757
 
 
 
Product Description                                                           Catalog
  • PA9T/Phosphor Bronze
    Operating Temperature:
    -65°C to +125°C
    Processing Temperature: 260° FOR 120 sec. MAX
  • Contact Surface: .000010” Gold; Termination: .000100” Pure Tin, Matte
  • .100” [2.54mm]
  • 24 Total Contacts
  • Dual Readout
  • Dip Solder .025” [.64] Square(USE FOR S527 & S36)
  • No Mounting
  • MBB, .150”[3.81mm] Row to Row on Right Angle

 

SPECIFICATIONS
  • Accommodates .062” ± .008” [1.57 ± .20] PCB
  • PA9T Insulator
  • 3 AMP Current Rating Per Contact
  • 30 Milli OHM Maximum at Rated Current
  • Molded-in Key available In-between or in Contact Key
 

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